wafer process

Drying process in IC production line, introducing spin rinsing? drying methods after semiconductor wafer cleaning. Also describing the technical principle, structure fea-tures and process applications for newly developed CXS series spin rinse?

从IC生产线晶圆片旋转冲洗甩干工艺出发，介绍了半导体晶圆片清洗后的旋转冲洗甩干方法，以及新近开发研制的CXS系列旋转冲洗甩干机的技术原理、结构特点及工艺应用情况。

With the theoretical analysis, the computer simulation and the process experiment methods, this paper studies the liquid forming mechanism of silicon wafer for ELCC technology and makes provision for further research on the solidification microstructure control of the silicon sheet.

采用理论分析、计算机模拟与工艺实验相结合的方法，对ELCC技术硅片液态成形机制进行了研究，为进一步对硅片凝固过程组织控制的研究奠定基础。

Wafer handling robot is automated material handling equipment used in Lithography machine which is the core of semiconductor manufacturing equipment. Its working speed, positioning accuracy, reliability, cleanliness impact on the lithography process directly in the production efficiency and manufacturing quality.

光刻机是半导体制造的核心装备，硅片传输机器人是其内部专用的自动物料处理设备，它的工作速度、定位精度、可靠性，使用洁净度等直接影响光刻工序中的生产效率和制造质量。

The intellectualized sensors accomplish temperature and static pressure compensation by software to solve a puzzle which non-smart sensors can't compensate static error ago, which has to resolve by improving process technology of wafer in previous technology.

传感器的智能化从数字运算上解决传感器的温度补偿、静压补偿问题，解决了以前静压无法补偿，仅靠工艺解决的难题；

Manufacturing Technicians perform functions associated with all wafer production including operations, equipments, process and training.

制造技术师进行相关的所有大晶片生产包括运营, 设备, 工艺和培训.

From the perspectives of size, operating cash flow, process technology level, new product development readiness for specific target market and availability of professional technical team, CRM is well equipped to invest in the 6 inch wafer fabrication plant.

从华润微电子目前的经营规模、资本结构、经营性现金流、工艺技术水平以及针对目标市场的产品开发准备和专业技术人才队伍来看，已经具备了建设6英寸芯片生产线的组织资源。

Through the reliability test, the NTC CUP process is suitable for thinner bond wire. So we can reduce the cost of the product which is lower driving current through wafer process change.

通过可靠性试验的研究发现，NTC的CUP工艺，在目前情况下只适用于线径较细的焊接工艺，因而可以对一些驱动电流较低的产品进行芯片工艺改进，降低芯片成本。

The goal to evaluating process is to find the defect of reliability, reliability parameters and datum can be acquired through wafer level and packaged level reliability experiments in specific test structures, according to failure mechanisms.

对工艺过程进行评估的目的在于找出存在可靠性缺陷的地方，它是针对技术磨损的机理，通过对专门设计的测试结构进行封装级或圆片级可靠性测试，获取可靠性模型参数和可靠性信息。